A Study of Crosstalk Through Bonding and Package Parasitics in CMOS Mixed Analog-Digital Circuits

نویسندگان

  • Gabriella Trucco
  • Giorgio Boselli
  • Valentino Liberali
چکیده

This paper presents an approach for simulation of mixedsignal CMOS integrated circuits, aiming at estimating crosstalk effects, by identifying possible sources of disturbances in analog-digital integrated systems, such as current pulses drawn from voltage supplies. A simple expression of voltage and current in the pull-up and the pull-down of a CMOS logic gate can be derived. A computer program demonstrates the feasibility of the proposed approach, and a representation of digital switching noise in time domain has been derived. This representation has been used to perform an analog simulation using SPICE, to evaluate the propagation of the switching noise through the parasitic elements of the package and of the bonding wires.

برای دانلود متن کامل این مقاله و بیش از 32 میلیون مقاله دیگر ابتدا ثبت نام کنید

ثبت نام

اگر عضو سایت هستید لطفا وارد حساب کاربری خود شوید

منابع مشابه

Evaluation of package and technology effects on substrate-crosstalk isolation in CMOS RFIC

Crosstalk propagating through the silicon substrate is a serious limiting factor on the performance of advanced mixed analog-digital CMOS integrated circuits. This problem also appears in RF chips in the form of power leakage from local oscillators or power amplifiers, as well as noise coupled from the digital baseband circuitry. Several studies have presented measurements on simple test struct...

متن کامل

Crosstalk effects in mixed-signal ICs in deep submicron digital CMOS technology

This paper illustrates the crosstalk phenomenon and its impact on the design of mixed analog/digital circuits with high accuracy specifications. Generation of digital disturbs, propagation through the substrate, and effects on analog devices are considered, with particular emphasis on integrated circuits realized on heavily doped substrate, where traditional shielding is less effective. Techniq...

متن کامل

Modeling and Simulation of Substrate Noise in Mixed-Signal Circuits Applied to a Special VCO

The mixed-signal circuits with both analog and digital blocks on a single chip have wide applications in communication and RF circuits. Integrating these two blocks can cause serious problems especially in applications requiring fast digital circuits and high performance analog blocks. Fast switching in digital blocks generates a noise which can be introduced to analog circuits by the common su...

متن کامل

OF PACKAGE I / O LEAD ELECTRICAL PARASITICS FOR DIFFERENT PACKAGES Electrical Parameters Wire - bonding Package Type

This paper is concerned with the analysis and optimization of the ground bounce in digital CMOS circuits. First, an analytical method for calculating the ground bounce is presented. The proposed method relies on accurate models of the short-channel MOS device and the chip-package interface parasitics. Next the effect of ground bounce on the propagation delay and the optimum tapering factor of a...

متن کامل

The Characterizing Substrate Coupling in Deep-submicron Designs Substrate Coupling Ieee Design & Test of Computers

levels of circuit functionality in chips designed for compact consumer electronic products and the widespread growth of wireless communications have triggered the proliferation of mixed analogdigital systems. Single-chip designs combining digital and analog blocks built over a common substrate feature reduced levels of power dissipation, smaller package counts, and smaller package interconnect ...

متن کامل

ذخیره در منابع من


  با ذخیره ی این منبع در منابع من، دسترسی به آن را برای استفاده های بعدی آسان تر کنید

برای دانلود متن کامل این مقاله و بیش از 32 میلیون مقاله دیگر ابتدا ثبت نام کنید

ثبت نام

اگر عضو سایت هستید لطفا وارد حساب کاربری خود شوید

عنوان ژورنال:

دوره   شماره 

صفحات  -

تاریخ انتشار 2004